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  • An ambitious partner community of large technological facilities distributed over the national territory and located in 5 laboratories Strongly involved in research and technological development
  • A coherent and mutualized infrastructure of:
    • the top level equipment thanks to a national investment policy
    • excellent technological know-how and high-level scientific expertise
    • open access plateforms
    • coordinated research programs

Renatech’s clean rooms

FEMTO-ST
PLATEFORME MIMENTO

Besançon

Clean room: 865 m² (ISO 5 to 7)
Main research themes: Micro and nano acoustics, Micro and Nano optics, Microrobotics, Silicon, MOEMS
R&D technology: 12 members technical staff
Specific tools: AIN deposition, E-Beam lithography,
Spray coating, Dry plasma etching (Si, quartz, LINbO3),FIB,
Wafer bonding, Precision dicing, Mechanical characterization,
Industrial production line for plezoelectric components.

LAAS

Toulouse

Clean room: 1 600 m² (ISO 4 to 6)
Main research themes: System integration: RF, Energy, Photonics, Micro and nano systems for biology, Health and environment
R&D technology: 36 members technical staff
Specific tools: Lithography (E-beam, Laser, UV by projection), PVD, Electroplating, PECVD, LPCVD, ALD, DRIE, Ion implantation, FIB, Ink jet, Screen printing, Die thinning and assembly

IEMN

Lille

Clean room: 1 600 m² (ISO 5 to 6)
Main research themes: III-V Electronics, Flexible electronics, Nano characterization, MEMS-NEMS
R&D technology: 22 members technical staff
Specific tools: III-V epitaxy, E-Beam lithography, III-V/SI ICP plasma etching, LPCVD, PECVD, Ion implantation, FIB, AFM/STM, Four probes STM

LTM

Grenoble

Clean room: 1 200 m² (ISO 4 to 6)
Main research themes: Nano electronics, Spintronics, Nano systems
R&D technology: 32 members technical staff
Specific tools: E-Beam lithography, etching/deposition metals and oxides, Micro/nano systems, CMP, UVtherm NIL, FIB dual beam

IEF
PLATEFORME CTU

Orsay

Clean room: 650 m² (ISO 5 to 7) + 440 m² (material)
Main research themes: Silicon nanophonics, Spintronics, optoelectronic devices, microsystems

R&D technology: 17 members technical staff
Specific tools: IV-IV epitaxy, Magnetic thin layers, E-Beam lithography, Deep-UV lithography, Direct laser writing, ICP deep etching of silicon, Optical vibrometry

LPN

Marcoussis

Clean room: 700 m² (ISO 4 to 6) + 300 m² (épitaxie)
Main research themes: III-V Nanophonics, Quantum nanoelectronics, Optoelectronics devices, Microfluidics
R&D technology: 22 members technical staff
Specific tools: III-V epitaxy (MBE, MOCVD), E-Beam lithography tools, III-V deep etching, NanoFIB, AFM/STM, nanoimprint lithography tools, STEM with correction of aberration, 3D lithography, Xray analysis